- Jul 31, 2017 -
Precision cutting is one of the main processing technologies for the preparation of semiconductors and photolithographic substrates, and has a high position in the manufacturing process of microelectronics and optoelectronic devices. With the rapid development of microelectronics and optoelectronic technology, the semiconductor and photonic crystal cutting processing put forward higher requirements. High efficiency, low cost, high precision, narrow slit, small warping deformation, low surface damage, low fragmentation rate, no environmental pollution is the current semiconductor and photonic crystal cutting processing of new trends.
Now, hard and brittle crystal cutting methods are diamond circular saw cutting, band saw cutting, wire saw cutting. Diamond saws are divided into diamond diamonds and diamond within the circular saw two; band saw is divided into steel, according to diamond saws, steel saws three; wire saws are divided into wire saws, diamond beads saws, diamond saws Three kinds.